TI Expands Portfolio of Widely Adopted OMAP(TM) Reference Designs With Industry's First EDGE Smartphone Chipset Solution

With up to three times the data rate throughput of current GSM/GPRS devices, the TCS3500 chipset delivers the performance required to enable high- quality EDGE-enabled applications such as multimedia, gaming, camera functionality, and video. The TCS3500 chipset is the first of a portfolio of EDGE solutions TI is developing to allow customers to optimally address multiple market segments.

"With the evolution of GSM/GPRS to EDGE, and the rapid growth of the smartphone and feature phone markets, manufacturers and operators are demanding a broad portfolio of solutions to differentiate their products and services," said Rick Kornfeld, vice president and general manager of TI's wireless chipset business. "By leveraging the proven success of predecessor OMAP730-based GSM/GPRS reference designs, we are able to offer our customers a complete smartphone reference design highly integrated with all the components required to build full-featured handsets based on the EDGE standard."

Leveraging OMAP Processors and TI's Wireless Expertise

TI's TCS3500 solution and reference design supports all leading mobile operating systems including Symbian OS, Microsoft's Windows Mobile(TM), Linux and Palmsource, as well as Nokia's Series 60 terminal software platform. Support of standard real-time operating systems, such as Nucleus, offers a migration path for feature-rich GPRS phones transitioning toward EDGE-based solutions. The TCS3500 solution also supports multiple third-party Java platforms allowing the design of true next-generation Java phones. In addition, TI's OMAP Developer's Network ensures a continuous stream of compelling applications for all OMAP-processor based solutions.

TI's TCS3500 Chipset -- a Complete EDGE-ready Smartphone Solution

The TCS3500 is anchored by the OMAP850, a high-performance applications processor integrated with a quad-band EDGE modem. The OMAP850 processor will enable a rich experience with both multimedia and camera capabilities up to 2.0 megapixels. The OMAP850 maintains the secure environment of the current generation of OMAP processors, which includes a secure boot, a secure execution environment and hardware encryption accelerators. The OMAP850 processor's modem functionality is based upon TI's prior generations of proven GSM/GPRS technology, with further enhancements to support the higher EDGE data rates. The industry's most flexible EDGE-capable processor, the OMAP850 allows scalability of a single platform to address all handset segments targeting high-revenue data services -- from mid-range feature phones, through high-end smartphones, up to multimedia rich wireless PDAs.

Also included as part of the TCS3500 solution is the TWL3027, which integrates an analog baseband with power management and an audio codec. The TCS3500 reference design includes a fully optimized quad-band RF solution. The highly integrated TCS3500 smartphone reference design also includes TI's single-chip Bluetooth device, the BRF6150.

Bringing added capabilities for full-featured EDGE handsets, the TCS3500 can be incorporated with optional modules from TI's wireless technology portfolio, including a camera, TI's TGS5000 assisted GPS (A-GPS) solution and TI's TNETW1230 low-power, high-speed WLAN solution.

Complete Solution Reference Design Speeds Time to Market

The TCS3500 reference design includes a complete bill of materials, board design and layout, GSM/GPRS/EDGE protocol stack and a full array of development tools. The pre-field type approved (FTA) certified reference design significantly cuts development time and gives manufacturers more time to focus on differentiation and application development. Customers also have access to TI's worldwide solution delivery organization to quickly customize, assist through the FTA process, and take new products to market.

TI expects to ship samples of the TCS3500 beginning in first quarter 2004. Volume production is expected in fourth quarter 2004.

TI -- Making Wireless

TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. From custom to turn- key solutions, including complete chipsets and reference designs, OMAP(TM) application processors, core digital signal processor and analog technologies built on advanced semiconductor processes, TI is making wireless personal, intelligent and seamless.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

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